From left to right: Dr Artem Grebenko, Dr Alena Alekseeva, and Prof Barbaros Oezyilmaz, checking the positioning of the wafer within the UV laser-assisted CVD set-up used for the growth of ultra-low-k amorphous carbon. As transistors inside microchips continue to shrink, the metal wiring that connects them is becoming a growing obstacle to faster, more energy-efficient chips. Narrower wires have g
Technology & Innovation#National University of Singapore#CDE Research News#Cde News#Research Impact#advanced materials#innovation
The U.S. National Science Foundation is investing $50 million in research infrastructure to enable the discovery and development of materials that can withstand extreme conditions, from lightweight…
Fusion EnergyTechnology & Innovation#U.S. National Science Foundation#fusion#plasma physics#advanced materials#innovation
